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CASIC using BGA machine case

Time:2019-05-14 Views:1142
China Aerospace Science and Industry Corporation Limited (English name China Aerospace Science and Industry Corporation Limited) was established on July 1, 1999.
It is a large state-owned high-tech enterprise directly managed by the central government. The five research institutes have successively experienced the historical evol-
ution of the Seventh Ministry of Machinery Industry (incorporated into the Eighth Ministry of Machinery Industry in September 1981), the Ministry of Aerospace Industry,
the Ministry of Aerospace Industry, and China Aerospace Industry Corporation. China Aerospace Mechanical and Electrical Corporation was established on July 1, 1999,
and was renamed China Aerospace Science and Industry Corporation in July 2001. Aerospace Science and Industry is now composed of headquarters, 5 research insti-
tutes, 2 scientific research and production bases, and 11 corporate and joint-stock enterprises. Holding 6 listed companies. There are more than 570 enterprises and insti-
tutions in the territory, distributed in 30 provinces, municipalities and autonomous regions across the country. There are more than 137,000 employees and a large number
of well-known experts and scholars, including 8 academicians of the Chinese Academy of Sciences and Chinese Academy of Sciences, and more than 200 national-level
scientific and technological talents. High-quality and young scientific and technical personnel have become the main body of the enterprise‘s innovative talent team. . It has
a number of national key laboratories, technological innovation centers, achievement incubation centers, and a complete scientific research and production system for prof-
essional categories.

With the rapid development of science and technology today, all aspects of people’s lives are getting better and better. Because of the continuous development of science and
technology, the application of various science and technology and the availability of science and technology products have brought people a variety of conveniences and solved
the problem. Many of the original troubles in life make life more and more happier. But all these technological developments and the popularization of technological products, in
addition to the continuous exploration and innovation of scientists, the continuous upgrading and application of chip packaging, also play a vital role.

Due to its small size, the BGA chip packaging method has very high requirements for solder joints during application. If the solder joints have problems such as empty soldering
or virtual soldering, it will directly cause the BGA package to fail. How to improve the reliability of BGA solder joints requires reliable BGA rework station equipment.

The Dinghua series BGA rework station produced by Shenzhen Dinghua Technology Development Co., Ltd. has the advantages of precise temperature control, simple operation
and high welding success rate. It is also very popular in the military industry and scientific research units. To help them solve the problem of chip packaging and soldering in the
development of new products, it has become a popular and practical device.

China Aerospace Science and Industry Group Co., Ltd. finally determined that the Dinghua series of BGA rework stations are superior in quality, performance and rework success
rate by comparing various indicators of many BGA rework equipment at home and abroad. In 2015, it cooperated with Dinghua. The company reached a cooperation agreement to
purchase Dinghua BGA rework stations for the welding and disassembly of chip packaging during the development of new projects of China Aerospace Science and Industry Corp-
oration, which contributed to the success of China Aerospace Science and Industry Corporation for its new product research and development.
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