| Rated power | 8200W |
| Upper power | 1200W |
| Lower power | 1200W |
| IR preheating power | 5800W |
| Chip application |
POP, CCGA,BGA,QFN and CSP etc.
|
| Temperature profiles storage | 50000 groups |
| Chip feeding system | Automatic picking up and replacing |
| Optical CCD working mode | Front, back, left and right |
| PCB positioning |
Up and down intelligent positioning,bottom "5-point support" with V-groove fixing PCB which can be adjusted freely in the X-axis direction, with universal fixtures
meanwhile
|
| Chip mounting | Laser positioning and optical CCD locating |
| Temperature accuracy | ± 1 ℃ |
| Alignment accuracy |
0.01mm
|
|
PCB size
|
Max 450×500 mm Min 10×10mm
|
| Chip size | 1*1~100*100mm |
| Min spacing | 0.15mm |
| Min LED spacing | 0.1mm |
| External temperature ports | 4 pcs (optional) |
| Dimensions |
L900×W850×H1750 mm |
| Weight | 200kg |
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+8615768114827 +86-755-29091822 |
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4th Floor, Building 6B, Shengzuozhi Technology park, Xinqiao(518125), Bao‘an, Shenzhen, Guangdong, the People‘s Republic of China |
Email
John- VK App,too
Skype
+86 157 6811 4827+8613923792185Roger
